IEC 61189-2-721電氣材料、印制板和其他互連結(jié)構(gòu)和組件的試驗(yàn)方法。第2-721部分
標(biāo)準(zhǔn)名稱
IEC 61189-2-721 Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 2-721: Test methods for materials for interconnection structures – Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator
IEC 61189-2-721電氣材料、印制板和其他互連結(jié)構(gòu)和組件的試驗(yàn)方法。第2-721部分:互連結(jié)構(gòu)材料的試驗(yàn)方法。使用分離后介質(zhì)諧振器在微波頻率下對(duì)覆銅板的相對(duì)介電常數(shù)和損耗正切的測(cè)量
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適用范圍
Scope:
This part of IEC 61 1 89 outlines a way to determine the relative permittivity ( ε r ) and loss tangent (tan δ ) (also called dielectric constant (Dk) and dissipation factor (Df)) of copper clad laminates at microwave frequencies (from 1 ,1 GHz to 20 GHz) using a split post dielectric resonator (SPDR).
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出自GF2022
